VC Plate

Short Description:

VC plate heat sink features: The liquid at the bottom of the real cavity absorbs the heat of the chip, evaporates and spreads into the real cavity, transmits the heat to the heat dissipation fin, and then condenses into a liquid back to the bottom.

Advantages: Heat is transmitted on a two-dimensional surface, thus achieving quite high heat dissipation efficiency.

Disadvantages; Copper surface is easy to natural oxidation, high material cost, mold cost is higher.

The VC is also called VC thermostat, VC heat sink, VC heat plate, mainly used in mobile phones, computers, servers, graphics cards, etc., play a heat dissipation role. The existing hot plate are mostly copper substrate for welding, including sintering structure. Sintering structure, generally for the copper shell surface, the surface is used in the form of sintering powder to form micropores, to achieve condensation reflux. In terms of heat dissipation technology, the traditional copper and aluminum heat dissipation technology is aiming at the growing demand for power heat dissipation, and the current cooling technology has been involved in various methods. In particular, military high-power equipment, high power density, warm and warm heat is difficult. At present, the most effective means is to use the average heat equalization plate technology of phase change principle to make better and more stable average temperature heat dissipation products.